Targeting Excellence in Electronics Assembly

IPC-A-610, Acceptability of Electronic Assemblies is the most widely used standard published by the IPC. With multiple language versions, it has an international reputation as the source for end product acceptance criteria for consumer and high reliability printed wiring assemblies.

An industry developed and approved program that includes theoretical training, certification and instructional materials based on the IPC-A-610 is available to your company. This certification will demonstrate your commitment to customer requirements and greatly assists any company dedicated to ISO-9000 or other quality assurance initiatives.

This training and certification has immediate recognition, legitimacy and value throughout the electronics industry.

Course topics

The Course content is arranged in the following modules:

Module 1 (Mandatory): Introduction/IPC Professional Training Policies and Procedure

Module 2 (Mandatory): Foreword, Applicable Documents & Handling

Electro-Static Discharge (ESD), Handling Considerations, Anti-Static and Static-Protective Coverings, the Wearing of Gloves and other Cleanliness Considerations.

Module 3 (Optional): Hardware

Hardware Installation, Threaded Hardware, Connector Pins, Jackpost Hardware, Wire Bundle Securings and Routing.

Module 4 (Optional): Soldering

Soldering Criteria, Lead-Free Connections, Lead-Free Alloys, Contamination of Fluxes, the use of different types of Flux and Solder Wire.

Module 5 (Optional): Terminal Connection

Soldering requirements for connecting to terminals, such as Turret, Bifurcated, Slotted and Solder Cups.

Module 6 (Optional): Through-Hole Technology

Component Mounting , Securing and Jumper wires for both Supported and Unsupported Holes

Module 7 (Optional): Surface Mount Assemblies

Criteria for Chip Components, Leadless and Leaded Chip Carriers, BGA Components, MELF and Castellated Terminations, Gull-wing and J-lead Components, as well as Staking Material, Heatsink Requirements of Mechanical Assemblies, Solder Anomalies like Tombstoning, Dewetting, Voiding, Non-wetting, Blow-holes and others.

Module 8 (Optional): Component Damage and PCBs and Assemblies

Component Damage, Laminate Conditions, Cleaning and Coating. Laminate Conditions such as Measles, Blistering, Delamination and damage to components such as Heat Sinks, Transformers, Relays, Conformal Coatings, Solder Masks, Printed Circuit Board Preparation and Cleanliness.

Module 9 (Optional): Solderless Wire Wrap

Number of turns, Turn Spacing, Wire Slack, Wire Dress and Damage.

Program Benefits

The IPC-A-610 Application Specialist course is best suited to quality personnel, in particular inspectors, quality engineers and managers.

By having earned this portable credential, you’ll receive immediate recognition, legitimacy and value throughout the electronics industry.

It is beneficial for anyone who is responsible for the visual inspection, quality and the reliability of electronic and electrical assemblies, including inspection personnel, maintenance technicians, operators, process engineers, sales personnel and manufacturing staff.

Successful candidates are awarded with internationally-recognized certificates.

Who should attend IPC-A-610 training?

The IPC-A-610 Training and Certification Program offers those interested in company-wide quality assurance initiatives an industry traceable, IPC-sponsored program to support their commitment to continuous improvement of product quality and reliability.